NextFin News — Semiconductor metrology and wafer inspection equipment vendor Shenzhen Angstrom Excellence Technology completed a Series B+ financing round totaling nearly 1 billion yuan ($138 million) on Tuesday.
A broad syndicate of state-backed capital vehicles and institutional investment firms led the transaction, including China Reform Fund, Kunpeng Capital, GL Ventures, Beijing E-Town Capital, CCB Equity Investment, and China Fortune-Tech Capital, with existing shareholders Shenzhen Capital Group, Changjiang Capital, and China Merchants Securities providing follow-on equity. Angstrom Excellence will deploy the proceeds to build out high-volume equipment manufacturing infrastructure, establish nationwide customer service and logistics networks, and accelerate targeted engineering research across advanced node process metrology, advanced packaging inspection systems, and high-end scientific analytical instruments.
Commercial semiconductor foundries across the Chinese mainland encounter persistent operational risks as international export controls restrict access to critical optical and electron-beam inspection hardware from established overseas suppliers. Strategic venture capital firms and government-backed industrial guidance funds are concentrating equity investments in specialized equipment makers to secure proprietary yield-management tools, ensuring technical self-sufficiency across advanced logic manufacturing nodes and high-density heterogeneous packaging facilities.
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