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MediaTek to Use Both TSMC and Intel Chips Due to TSMC's Supply Shortage

Summarized by NextFin AI
  • MediaTek plans to adopt both CoWoS and EMIB-T technologies simultaneously for large-scale AI ASIC development, responding to packaging constraints.
  • TSMC's CoWoS capacity is fully booked until 2027, forcing some customers to wait over a year and seek Intel's EMIB-T as an alternative.
  • Broadcom and Meta are considering switching from CoWoS to EMIB to reduce costs amid supply limitations.
  • Google and NVIDIA have shown strong interest in Intel's EMIB-T technology as the advanced packaging market diversifies.

NextFin News -- Taiwan-based MediaTek has said that it plans to adopt both CoWoS and EMIB-T technologies simultaneously for the large-scale development of application-specific integrated circuits (ASICs) for artificial intelligence.

Due to TSMC's CoWoS short supply, customers are forced to turn to Intel's EMIB-T technology as an alternative solution. TSMC's CoWoS orders are fully booked until 2027, with some customers needing to wait over a year to receive their orders.

Broadcom and Meta are also considering transitioning from CoWoS to EMIB to reduce costs, while Google and NVIDIA have shown strong interest in EMIB-T.

Explore more exclusive insights at nextfin.ai.

Insights

What is TSMC CoWoS packaging tech?

How does Intel EMIB-T technology work?

What are AI ASIC chips used for?

Why is chip packaging key for AI?

Why is TSMC CoWoS supply short?

How long is TSMC CoWoS fully booked?

Which firms use TSMC CoWoS now?

Is Intel EMIB-T production ready?

What did MediaTek announce about chips?

Why switch to Intel EMIB-T now?

Did NVIDIA show interest in EMIB?

Is Meta switching to cut costs?

Will Intel gain foundry market share?

Can EMIB match CoWoS performance?

Will TSMC expand CoWoS capacity?

How will AI chip costs change?

What risks does dual sourcing bring?

Is Intel foundry service reliable?

How does EMIB compare to CoWoS tech?

Why did Broadcom switch packaging tech?

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