AsianFin -- Micron Technology has broken ground on a new high-bandwidth memory (HBM) advanced packaging plant in Singapore, the first of its kind in the country.
The new facility is expected to start operations in 2026 and will begin expanding Micron’s overall advanced packaging capacity in 2027 to meet the growing demand driven by artificial intelligence.
Micron’s investment in the HBM advanced packaging sector is approximately $7 billion (S$9.5 billion), which will create around 1,400 jobs, with plans to expand the workforce to approximately 3,000 positions in the future.
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